title
  • image of System On Chip (SoC)>XCVC1702-1MLINSVG1369
  • image of System On Chip (SoC)>XCVC1702-1MLINSVG1369
  • Part number XCVC1702-1MLINSVG1369
    Product classification System On Chip (SoC)
    description IC VERSAL AI-CORE FPGA 1369BGA
    encapsulation Tray
    quantity 200
    price $25,261.2500
    RoHS status YES
    specifications
    PDF(1)
    TYPEDESCRIPTION
    MfrXilinx (AMD)
    SeriesVersal™ AI Core
    PackageTray
    Product StatusACTIVE
    Package / Case1369-BFBGA, FCBGA
    Speed600MHz, 1.3GHz
    RAM Size256KB
    Number of I/O500
    Operating Temperature-40°C ~ 110°C (TJ)
    Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
    Primary AttributesVersal™ AI Core FPGA, 1M Logic Cells
    ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    PeripheralsDDR, DMA, PCIe
    Supplier Device Package1369-FCBGA (35x35)
    ArchitectureMPU, FPGA