title
  • image of Solder>WS991LT35T4
  • image of Solder>WS991LT35T4
  • Part number WS991LT35T4
    Product classification Solder
    description THERMALLY STABLE SOLDER PASTE WS
    encapsulation Bulk
    quantity 214
    price $42.4400
    RoHS status YES
    specifications
    PDF(1)
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    TYPEDESCRIPTION
    MfrChip Quik, Inc.
    SeriesCHIPQUIK®
    PackageBulk
    Product StatusACTIVE
    CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
    TypeSolder Paste
    Melting Point280°F (138°C)
    FormSyringe, 1.23 oz (34.869g)
    Mesh Type4
    Flux TypeWater Soluble
    Storage/Refrigeration Temperature37°F ~ 77°F (3°C ~ 25°C)
    Shelf Life StartDate of Manufacture
    Shelf Life12 Months