title
  • image of Memory>W66BQ2NQQAFJ
  • image of Memory>W66BQ2NQQAFJ
  • Part number W66BQ2NQQAFJ
    Product classification Memory
    description 2GB LPDDR4X, DDP, X32, 1600MHZ,
    encapsulation Tray
    quantity 200
    price $6.7300
    RoHS status NO
    specifications
    PDF(1)
    TYPEDESCRIPTION
    MfrWinbond Electronics Corporation
    Series-
    PackageTray
    Product StatusACTIVE
    Package / Case200-TFBGA
    Mounting TypeSurface Mount
    Memory Size2Gbit
    Memory TypeVolatile
    Operating Temperature-40°C ~ 105°C (TC)
    Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
    TechnologySDRAM - Mobile LPDDR4X
    Clock Frequency1.6 GHz
    Memory FormatDRAM
    Supplier Device Package200-TFBGA (10x14.5)
    Write Cycle Time - Word, Page18ns
    Memory InterfaceLVSTL_06
    Access Time3.6 ns
    Memory Organization64M x 32