title
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0820-05-3BE21ML
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0820-05-3BE21ML
  • Part number TE0820-05-3BE21ML
    Product classification Microcontrollers, Microprocessor, FPGA Modules
    description MOD MPSOC 2GB DDR4
    encapsulation Bulk
    quantity 200
    price
    RoHS status NO
    specifications
    PDF(1)
    TYPEDESCRIPTION
    MfrTrenz Electronic
    SeriesTE0820
    PackageBulk
    Product StatusDISCONTINUED
    Connector TypePin(s)
    Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
    RAM Size2GB
    Operating Temperature0°C ~ 85°C
    Module/Board TypeMPU Core
    Core ProcessorARM® Cortex®-A53, ARM® Cortex®-R5
    Co-ProcessorXilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
    Flash Size128MB