title
  • image of Solder Stencils, Templates>PA0193-S
  • image of Solder Stencils, Templates>PA0193-S
  • Part number PA0193-S
    Product classification Solder Stencils, Templates
    description TSSOP-16-EXP-PAD STENCIL
    encapsulation Bulk
    quantity 200
    price $11.5900
    RoHS status YES
    specifications
    PDF(1)
    PDF(2)
    PDF(3)
    PDF(4)
    PDF(5)
    TYPEDESCRIPTION
    MfrChip Quik, Inc.
    SeriesProto-Advantage PA
    PackageBulk
    Product StatusACTIVE
    MaterialStainless Steel
    Pitch0.026" (0.65mm)
    TypeTSSOP
    Inner Dimension0.197" L x 0.173" W (5.00mm x 4.40mm)
    Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
    Thermal Center Pad0.433" L x 0.118" W (11.00mm x 3.00mm)
    Number of Positions16