specifications
PDF(1)
PDF(2)
TYPE | DESCRIPTION |
Mfr | Chip Quik, Inc. |
Series | CHIPQUIK® |
Package | Bulk |
Product Status | ACTIVE |
Diameter | 0.015" (0.38mm) |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Type | Wire Solder |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Form | Tube, 0.2 oz (5.66g) |
Flux Type | No-Clean |