title
  • image of Solder>JET551AX30T5
  • image of Solder>JET551AX30T5
  • Part number JET551AX30T5
    Product classification Solder
    description JET PRINTING SOLDER PASTE SN63/P
    encapsulation Bulk
    quantity 200
    price $91.9500
    RoHS status YES
    specifications
    PDF(1)
    TYPEDESCRIPTION
    MfrChip Quik, Inc.
    SeriesCHIPQUIK®
    PackageBulk
    Product StatusACTIVE
    CompositionSn63Pb37 (63/37)
    TypeSolder Paste
    Melting Point361°F (183°C)
    FormSyringe, 3.53 oz (100g)
    ProcessLeaded
    Flux TypeNo-Clean
    Shelf Life StartDate of Manufacture
    Shelf Life12 Months