title
  • image of System On Chip (SoC)>AGFB006R24D2I3V
  • image of System On Chip (SoC)>AGFB006R24D2I3V
  • Part number AGFB006R24D2I3V
    Product classification System On Chip (SoC)
    description IC
    encapsulation Tray
    quantity 200
    price $6,323.0400
    RoHS status NO
    specifications
    TYPEDESCRIPTION
    MfrIntel
    SeriesAgilex F
    PackageTray
    Product StatusACTIVE
    Package / Case2340-BFBGA Exposed Pad
    Speed1.4GHz
    RAM Size256KB
    Number of I/O576
    Operating Temperature-40°C ~ 100°C (TJ)
    Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
    Primary AttributesFPGA - 573K Logic Elements
    ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    PeripheralsDMA, WDT
    Supplier Device Package2340-BGA (45x42)
    ArchitectureMPU, FPGA